- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Hermetic Packaging Capabilities: Ceramic & Metal Can
- Ceramic 600 & 400 mil DIP SOJ
- Two-sided LCC
- Four-sided LCC
- Gull Wing
- QFP
- PGA
- Flat Pack
- Formed-leaded Flat Pack
- Metal Can
Micross has served the aerospace, defense and space hi-reliability custom-assembly and test marketplace for 40+ years. We’ve designed and produced a wide assortment of custom hermetic devices. Many address the hi-reliability requirements and custom ceramic-packaging needs of the SATCOM and space community.
Micross is registered under AS9100 in every one of our manufacturing sites and holds MIL-PRF-38534 Class H, MIL-PRF-38535 Class Q and MIL-PRF-38535 Class Q and V (assembly & test) certifications.
If you have special requirements, we can work to modify standard specifications to suit your program or application.
Webinar - Optimizing Hi-Rel Electronics Design for Your Applications